| Author | Peter A. Engel |
| Format | Hardcover |
| ISBN | 9780387979397 |
| Publication Date | 02/03/2005 |
| Publisher | Springer |
| Manufacturer | Springer-verlag New York Inc |
Treats a broad range of electronics packaging systems from the point of the view of the mechanical engineer of at least a college senior level. Describes structural analysis methods for leadless, pin-in-hole, and surface mounted attachments of components (modules), under mechanical as well as thermal loads, emphasizing the engineering characteristi
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