Wafer Level 3-D ICs Process Technology Integrated Circuits and Systems

Name: Wafer Level 3-D ICs Process Technology Integrated Circuits and Systems
Brand: Springer-verlag New York Inc.
SKU: 18500570
Price: 4061.00 ZAR
Availability: InStock

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Features

Author	Chuan Seng Tan et. al.
Format	Hardcover
ISBN	9780387765327
Publication Date	01/08/2008
Publisher	Springer
Manufacturer	Springer-verlag New York Inc.

Description

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

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